A00200 - SEMI A2 - Specification for Surface Mount Assembler Smart Hookup (SMASH) Revision:SEMI A2-1019 - Superseded

A00200 - SEMI A2 - Specification for Surface Mount Assembler Smart Hookup (SMASH) Revision:SEMI A2-1019 - SupersededThe purpose of this Standard is to provide a standardized automation interface specification to be used for the equipment control in an assembly line for printed circuit board (PCB) that uses surface mount technology (SMT). The purpose of this Standard is to provide an interface specification that replaces conventional electrical interface with a network connection and adds data communication capability. The scope of this Standard is to define an

In the case of 150 mm wafers

different from that of this Test Method

based on nominal wafer diameter

it can be determined whether it is genuine or not anywhere in the distribution chain

The test condition such as fluid

The purpose of this Standard is to standardize requirements for package protection technology for transporting photovoltaic (PV) modules

the issue is control of film thickness variation introduced by nanotopography

The purpose of this Document is to define the test method used to characterize the susceptibility of semiconductor processing

1e12-1e13 C atoms/cm2

<measured qualification parameter>

This Document defines three orthogonal reference planes as references for carrier dimensions

향상된 캐리어(carrier) 핸드오프(handoff) 병렬 I/O 인터페이스는 능동 장비를 사용하여 수동 장비에서 주고 받는 캐리어(carrier)의 핸드오프(handoff)를 컨트롤(controls)한다